PCB Prototyping Parameters
List of Standard Parameters
To keep board cost to a minimum, it is best to work within these parameters for your PCB. Please email us if you are in need of anything beyond these specs.
Item |
Parameter |
|
Min. Line Width |
0.1mm |
|
Min. Space |
0.1mm |
|
Min. Annular Ring Width |
0.1mm |
|
Min. Hole Size |
0.15mm (Finished Product) |
|
Max. Aspect Ratio |
10:1 |
|
Max. Layers |
1-18 |
|
Board Thickness |
Double Side |
0.2mm-3.0mm |
Multilayer |
0.45-6.0mm |
|
Board Size |
Double Side |
600x800mm |
Multilayer |
550x800mm |
|
Gold Finger Thickness |
Ni Thickness |
120-150μ" |
Au Thickness |
5-20μ" |
|
Impedance Control |
±10% |
|
Board Outline Tolerance |
±0.13mm |
|
Finished Product Thickness Tolerance |
±0.10mm |
|
Finished Copper Thickness |
1-12oz (outer layers) |
|
Surface Plating |
HAL, Plated Ni/Au, Immersion Ni/Au, etc. |
|
Soldermask Color |
Green, white, black, blue, yellow, red, etc. |
|
Soldermask Hardness |
≥6H |
|
Fire Resistance |
94V-0 |
|
Board Materials |
FR-4, aluminum base, high frequency, etc. |
|
WARP |
≤1% |
|
Quality Standard |
GB4588.2, GB4588.4, IPC600E |
|